Pre-dry treatment before direct adhesive bonding using an atmospheric pressure plasma device.
Basic concept of molecular bonding adhesion and joining (direct adhesion) using a downstream atmospheric pressure plasma device.
Our company's downstream plasma device eliminates various damages that occur during processing, enabling clean treatment and smooth surface adhesion. It is suitable for applications such as FCCL manufacturing for 5G and 6G, as well as for carbon films in the secondary battery market, and for bonding dissimilar materials during electrode manufacturing and dry pre-treatment. Additionally, by changing the added gas and optimizing plasma parameters, we can selectively impart functional molecules (such as covalent bonding molecules) to the interface, matching the bonding molecules to the material of the joining interface. Even for challenging hydrophilization of PFA and PTFE surfaces, it is possible to reduce the contact angle to below 10 degrees. *Sample work is also conducted at our lab. [Contents] ■ Basic Concept ■ Advantages ■ Processing Image (R to R) *For more details, please refer to the PDF document or feel free to contact us.
- Company：イー・スクエア
- Price：Other
